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PCB Trace Current and Temperature-Rise Estimate — result sheet
Estimate current from copper cross-sectional area and an allowed temperature rise using a clearly labeled empirical starting relation.
Inputs used
Results
Visual chart
Breakdown
Calculation steps
Returned data table
Formula and methodology
Formula: For this empirical starting estimate, I = k(ΔT^0.44)(A^0.725), where A = width × copper thickness in mil²; k = 0.048 external or 0.024 internal.
Trace ampacity depends on geometry, copper, layer construction, surroundings, and thermal boundary conditions. The result is an empirical screening value that keeps the layer factor and allowed temperature rise explicit; it is not a substitute for the current-carrying standard, thermal simulation, or a fabricator's design rules.
This result follows the calculator's declared inputs, precision, validation boundaries, and model limits.
Input contract
- Trace location — 2 choices
- Trace width — mm; minimum 1.0E-6; maximum 1000000
- Copper thickness — mm; minimum 1.0E-6; maximum 1000000
- Allowed temperature rise — °C; minimum 1.0E-6; maximum 1000000
Worked example
| Input | Value |
|---|---|
| Trace location | external |
| Trace width | 1 |
| Copper thickness | 0.035 |
| Allowed temperature rise | 10 |
Estimated current ≈ 0.731 A for the stated simplified external-layer relation.
Assumptions and limits
- Width and thickness are entered in millimetres, then converted to square mils for this empirical relation.
- The external/internal constants are a simplified legacy starting relation, not a universal board approval limit.
- Copper plane spreading, adjacent conductors, airflow, vias, pulses, reliability class, and ambient temperature are not modeled.
Calculator note
Source and methodology
Use the official WorldCalculate methodology policy for the source, formula, precision, and boundary standards behind this calculator.
Planning estimate, not financial, medical, legal, or professional advice. © WorldCalculate — reuse with attribution. Built and curated by Hassan ALRowaie.
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